For high-end Panel
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Large panel size: up to 660 x 558 mm Equipped with high-intensity lamp: 25% shorter exposure time |
HEPA filter and mask film/exposure stage cleaning mechanism are standard |
High Productivity
Cleanliness (Class 100)
High resolution
High-precision alignment system (alignment repeatability ±3μm)
Partition exposure function
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High resolution
High resolution
DFR:T25μm L/S12μm |
SR:T25μm Φ50μm |
High-precision alignment
High-precision alignment
Product specification
Product specification
Model Type | EXP-2031B Standard size |
EXP-2031B Large size |
EXP-2031B Package size |
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Panel size | MAX.635×535 mm ~ MIN.330×300 mm | MAX.660×558 mm ~ MIN.330×300 mm | MAX.535×419 mm ~ MIN.330×300 mm |
Panel Thickness | 0.04 mm to 2.4 mm (excluding copper foil) | ||
Lamp used | For solder resist: 8kw short arc UV lamp For pattern: 4kw short-arc UV lamp | ||
Effective exposure area | 610×510 mm | 620×520 mm | 533×419 mm |
Initial intensity (max) | SR:85mW/c㎡ PT:35mW/c㎡ |
SR:63mW/c㎡ PT:35mW/c㎡ |
SR:92mW/c㎡ PT:35mW/c㎡ |
Intensity uniformity | Over 94% . | ||
Positioning Accuracy | ±3 μm (repeatability) | ||
Cycle Time | Batch exposure: 11.5 sec (including 2 sec vacuum time) + exposure time Segmented exposure: 7.5 sec (including 2 sec vacuum time) + exposure time x number of segments + 4 sec |
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Dimensions (main unit) | 4704(W) × 2745(D) × 2496(H) mm | ||
Weight | Main unit: approx. 4800 kg Separate unit: approx. 1200 kg |